Our Prototyping Capabilities
Our Prototyping Capabilities
At SOLDER Lab, we support the full prototype development cycle — from first build to design validation — with the same process discipline and inspection standards applied to our production work.
We assemble prototype PCBs across all major technologies, including SMT, through-hole, mixed-technology, BGA, fine-pitch, and rigid-flex — working directly from your Gerber files, BOM, and assembly drawings with minimal lead time.
Every prototype is inspected to IPC-A-610 and built under our ISO 9001 quality management system, giving engineers and product developers a reliable, well-documented baseline from day one.
Our prototyping capabilities include:
- SMT, THD, and mixed-technology prototype assembly
- BGA, QFN, LGA, CSP, and fine-pitch component placement
- Flexible and rigid-flex PCB assembly
- Wire harness and cable assembly prototypes
- Low-quantity builds — from a single unit upward
- Fast turnaround with direct technical communication
- Design for Manufacturability (DFM) feedback on request
- Full inspection records and traceability documentation
Whether you are validating a first design or iterating through engineering changes, SOLDER provides the hands-on expertise and quality assurance your prototype demands — backed by over 15 years of experience in high-reliability electronics assembly and approved Ministry of Defense supplier status.
